Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar Mirpuri | 2016-11-22 |
| 9335494 | Optoelectronics structures | Jibin Sun, Haipeng Zhang | 2016-05-10 |
| 9310555 | Mode size converters and methods of fabricating the same | Jibin Sun, Haipeng Zhang, Nicola Pugliano | 2016-04-12 |