Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar Mirpuri | 2016-11-22 | $9,157,000 |
| 9335494 | Optoelectronics structures | Jibin Sun, Haipeng Zhang | 2016-05-10 | $6,866,000 |
| 9310555 | Mode size converters and methods of fabricating the same | Jibin Sun, Haipeng Zhang, Nicola Pugliano | 2016-04-12 | $10,802,000 |