Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 | $15,019,000 |