Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508660 | Microelectronic die having chamfered corners | Emre Armagan, Rajendra C. Dias, Lars D. Skoglund | 2016-11-29 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |