Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 |