Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2016-05-03 | $11,131,000 |