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Home › 2016 › Intel › Yuying Wei

Yuying Wei — 1 Patent in 2016

Intel: 1 patents #2,105 of 5,207Top 45%

Chandler, AZ: #236 of 561 inventorsTop 45%

Arizona: #1,360 of 3,707 inventorsTop 40%

Overall (2016): #168,496 of 481,213Top 40%

1 Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9330993	Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby	Yiqun Bai, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more	2016-05-03	$11,131,000

Yuying Wei — 1 Patent in 2016

Issued Patents 2016

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