Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 | $11,131,000 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai | 2016-02-23 | $10,383,000 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 | $11,513,000 |