Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai | 2016-02-23 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |