Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515031 | Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects | Nevin Altunyurt, Kevin J. Doran, Yidnekachew S. Mekonnen | 2016-12-06 |
| 9515017 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2016-12-06 |
| 9478881 | Snap connector for socket assembly and associated techniques and configurations | Zhichao Zhang, Gaurav Chawla, Rajasekaran Swaminathan, Li Sun | 2016-10-25 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9391018 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Tao Wu | 2016-07-12 |
| 9240377 | X-line routing for dense multi-chip-package interconnects | Zhiguo Qian | 2016-01-19 |
| 9230900 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2016-01-05 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Digvijay A. Raorane, Daniel N. Sobieski, Drew W. Delaney | 2016-01-05 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Zhiguo Qian | 2016-01-05 |