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Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects |
Nevin Altunyurt, Kevin J. Doran, Yidnekachew S. Mekonnen |
2016-12-06 |
| 9515017 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2016-12-06 |
| 9478881 |
Snap connector for socket assembly and associated techniques and configurations |
Zhichao Zhang, Gaurav Chawla, Rajasekaran Swaminathan, Li Sun |
2016-10-25 |
| 9397071 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more |
2016-07-19 |
| 9391018 |
Crosstalk polarity reversal and cancellation through substrate material tuning |
Zhichao Zhang, Tolga Memioglu, Tao Wu |
2016-07-12 |
| 9240377 |
X-line routing for dense multi-chip-package interconnects |
Zhiguo Qian |
2016-01-19 |
| 9230900 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2016-01-05 |
| 9232686 |
Thin film based electromagnetic interference shielding with BBUL/coreless packages |
Digvijay A. Raorane, Daniel N. Sobieski, Drew W. Delaney |
2016-01-05 |
| 9232639 |
Non-uniform substrate stackup |
Zhichao Zhang, Tao Wu, Zhiguo Qian |
2016-01-05 |