Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478476 | Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package | Debendra Mallik, Sridhar Narasimhan, Mathew J. Manusharow | 2016-10-25 |