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Home › Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

US Patent 9478476 · Granted Oct 25, 2016

Estimated economic value: $11,658,000 ⓘ

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