Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449937 | Semiconductor device and method for manufacturing the same | Susumu Sawada, Seiichi Nakatani, Yoshihisa Yamashita | 2016-09-20 |
| 9449944 | Electronic component package and method for manufacturing same | Susumu Sawada, Seiichi Nakatani, Yoshihisa Yamashita | 2016-09-20 |
| 9425122 | Electronic component package and method for manufacturing the same | Seiichi Nakatani, Susumu Sawada, Yoshihisa Yamashita | 2016-08-23 |
| 9373762 | Electronic part package | Susumu Sawada, Yoshihiro Tomita, Masanori Nomura | 2016-06-21 |
| 9368469 | Electronic component package and method of manufacturing same | Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada | 2016-06-14 |
| 9236338 | Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package | Seiichi Nakatani, Susumu Sawada, Yoshihisa Yamashita | 2016-01-12 |