Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande | 2016-11-22 | $9,157,000 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Chia-Pin Chiu, Robert L. Sankman | 2016-05-24 | $13,693,000 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li | 2016-02-16 | $10,295,000 |