Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making high density substrate interconnect using inkjet printing

Method for making high density substrate interconnect using inkjet printing

US Patent 9349703 · Granted May 24, 2016

Estimated economic value: $13,693,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Multi-chip packaging2025
Ultra-thin, hyper-density semiconductor packages2025
Planar integrated circuit package interconnects2025
Heat dissipation structures for optical communication devices2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Coreless electronic substrates having embedded inductors2025
High density substrate routing in package2025
TEC-embedded dummy die to cool the bottom die edge hotspot2025
Inorganic-based embedded-die layers for modular semiconductive devices2025
Boiling enhancement structures for immersion cooled electronic systems2025