Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9390968 | Low temperature thin wafer backside vacuum process with backgrinding tape | — | 2016-07-12 | $10,128,000 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman | 2016-02-16 | $10,295,000 |