Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390968 | Low temperature thin wafer backside vacuum process with backgrinding tape | — | 2016-07-12 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman | 2016-02-16 |