Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-10-04 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-02-23 |