Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9451696 | Embedded architecture using resin coated copper | Dilan Seneviratne, Ching-Ping Janet Shen, Liwen Jin, Deepak Arora | 2016-09-20 | $10,814,000 |
| 9368401 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2016-06-14 | $9,885,000 |