Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451696 | Embedded architecture using resin coated copper | Dilan Seneviratne, Ching-Ping Janet Shen, Liwen Jin, Deepak Arora | 2016-09-20 |
| 9368401 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2016-06-14 |