Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451696 | Embedded architecture using resin coated copper | Ching-Ping Janet Shen, Liwen Jin, Deepak Arora, Vinodhkumar Raghunathan | 2016-09-20 |
| 9320149 | Bumpless build-up layer package including a release layer | Liwen Jin | 2016-04-19 |