Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797620 | Method and apparatus for improved electroplating fill of an aperture | John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Girish Dixit, Robin Cheung | 2004-09-28 |
| 6790323 | Self ionized sputtering using a high density plasma source | Jianming Fu, Praburam Gopalraja, John E. Foster | 2004-09-14 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6784096 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2004-08-31 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6743714 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo, Liang-Yuh Chen | 2004-06-01 |
| 6726776 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo | 2004-04-27 |
| 6679981 | Inductive plasma loop enhancing magnetron sputtering | Shaoher X. Pan, Hiroji Hanawa, John C. Forster | 2004-01-20 |