Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821881 | Method for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Lizhong Sun, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2004-11-23 |
| 6811680 | Planarization of substrates using electrochemical mechanical polishing | Wei-Yung Hsu, Alain Duboust, Ratson Morad, Daniel Carl | 2004-11-02 |
| 6776693 | Method and apparatus for face-up substrate polishing | Alain Duboust, Shou-Sung Chang, Yan Wang, Siew Neo, Lizhong Sun +1 more | 2004-08-17 |
| 6773507 | Apparatus and method for fast-cycle atomic layer deposition | Ravi Jallepally, Shih-Hung Li, Alain Duboust, Jun Zhao, Daniel Carl | 2004-08-10 |
| 6743714 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Fusen Chen, Ted Guo | 2004-06-01 |
| 6740221 | Method of forming copper interconnects | Robin Cheung | 2004-05-25 |
| 6693030 | Reactive preclean prior to metallization for sub-quarter micron application | Suchitra Subrahmanyan, Roderick C. Mosely | 2004-02-17 |