Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824666 | Electroless deposition method over sub-micron apertures | Srinivas Gandikota, Chris McGuirk, Deenesh Padhi, Muhammad Malik, Sivakami Ramanathan +1 more | 2004-11-30 |
| 6818066 | Method and apparatus for treating a substrate | — | 2004-11-16 |
| 6797620 | Method and apparatus for improved electroplating fill of an aperture | John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Girish Dixit, Fusen Chen | 2004-09-28 |
| 6753248 | Post metal barrier/adhesion film | Michael Anthony Wood, Barry Chin, Paul Smith | 2004-06-22 |
| 6740221 | Method of forming copper interconnects | Liang-Yuh Chen | 2004-05-25 |