Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824666 | Electroless deposition method over sub-micron apertures | Srinivas Gandikota, Chris McGuirk, Deenesh Padhi, Muhammad Malik, Sivakami Ramanathan +1 more | 2004-11-30 |
| 6824612 | Electroless plating system | Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Donald Olgado, Howard Grunes +1 more | 2004-11-30 |
| 6821909 | Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application | Sivakami Ramanathan, Deenesh Padhi, Srinivas Gandikota | 2004-11-23 |
| 6808611 | Methods in electroanalytical techniques to analyze organic components in plating baths | Zhi-Wen Sun, Chunman Yu, Brian Metzger, David Nguyen | 2004-10-26 |
| 6797620 | Method and apparatus for improved electroplating fill of an aperture | John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Robin Cheung, Fusen Chen | 2004-09-28 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6773569 | Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives | Zhi-Wen Sun, Nicolay Kovarsky, Chunman Yu | 2004-08-10 |
| 6746591 | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature | Bo Zheng, Renren He | 2004-06-08 |