Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746591 | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature | Bo Zheng, Girish Dixit | 2004-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746591 | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature | Bo Zheng, Girish Dixit | 2004-06-08 |