Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793779 | Sputtering method for filling holes with copper | Peijun Ding, Tony P. Chiang | 2004-09-21 |
| 6790776 | Barrier layer for electroplating processes | Peijun Ding, Tony P. Chiang, Tse-Yong Yao | 2004-09-14 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2004-07-06 |
| 6753248 | Post metal barrier/adhesion film | Michael Anthony Wood, Paul Smith, Robin Cheung | 2004-06-22 |
| 6709987 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2004-03-23 |