Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793779 | Sputtering method for filling holes with copper | Tony P. Chiang, Barry Chin | 2004-09-21 |
| 6790776 | Barrier layer for electroplating processes | Tony P. Chiang, Tse-Yong Yao, Barry Chin | 2004-09-14 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6692617 | Sustained self-sputtering reactor having an increased density plasma | Jianming Fu, Zheng Xu | 2004-02-17 |