Issued Patents 2002
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500727 | Silicon shallow trench etching with round top corner by photoresist-free process | Cheng-Ku Chen, Fang Chen | 2002-12-31 |
| 6498067 | Integrated approach for controlling top dielectric loss during spacer etching | Baw-Ching Perng, Ming-Huang Tsai, Ju-Wang Hsu | 2002-12-24 |
| 6497993 | In situ dry etching procedure to form a borderless contact hole | Yuan-Hunh Chiu, Chia-Shiung Tsai, Chu-Yun Fu | 2002-12-24 |
| 6479403 | Method to pattern polysilicon gates with high-k material gate dielectric | Ming-Huan Tsei, Baw-Ching Perng | 2002-11-12 |
| 6472335 | Methods of adhesion promoter between low-K layer and underlying insulating layer | Chia-Shiung Tsai, Yao-Yi Cheng | 2002-10-29 |
| 6444566 | Method of making borderless contact having a sion buffer layer | Ming-Huan Tsai, Jyh-Huei Chen, Chu-Yun Fu | 2002-09-03 |
| 6440863 | Plasma etch method for forming patterned oxygen containing plasma etchable layer | Chia-Shiun Tsai, Chao-Cheng Chen | 2002-08-27 |
| 6436841 | Selectivity oxide-to-oxynitride etch process using a fluorine containing gas, an inert gas and a weak oxidant | Ming-Huan Tsai, Bao-Ching Pen, Mei-Ru Kuo | 2002-08-20 |
| 6410424 | Process flow to optimize profile of ultra small size photo resist free contact | Ming-Huan Tsai, Chung-Long Chang, Chii-Ming Wu | 2002-06-25 |
| 6407002 | Partial resist free approach in contact etch to improve W-filling | Li-Te Lin, Yuan-Hung Chiu, Ming-Huan Tsai | 2002-06-18 |
| 6399483 | Method for improving faceting effect in dual damascene process | Jen-Cheng Liu, Ming-Huei Lui, Chia-Shiung Tsai | 2002-06-04 |
| 6399515 | Plasma etch method for forming patterned chlorine containing plasma etchable silicon containing layer with enhanced sidewall profile uniformity | Chia-Shiung Tsai | 2002-06-04 |