Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6497993 | In situ dry etching procedure to form a borderless contact hole | Yuan-Hunh Chiu, Hun-Jan Tao, Chia-Shiung Tsai | 2002-12-24 |
| 6479385 | Interlevel dielectric composite layer for insulation of polysilicon and metal structures | Syun-Ming Jang | 2002-11-12 |
| 6461966 | Method of high density plasma phosphosilicate glass process on pre-metal dielectric application for plasma damage reducing and throughput improvement | Yao-Hsiang Chen, Syung-Ming Jang | 2002-10-08 |
| 6444566 | Method of making borderless contact having a sion buffer layer | Ming-Huan Tsai, Jyh-Huei Chen, Hun-Jan Tao | 2002-09-03 |
| 6426272 | Method to reduce STI HDP-CVD USG deposition induced defects | Li-Jen Chen | 2002-07-30 |
| 6423653 | Reduction of plasma damage for HDP-CVD PSG process | Syun-Ming Jang | 2002-07-23 |
| 6372664 | Crack resistant multi-layer dielectric layer and method for formation thereof | Syun-Ming Jang, Chen-Hua Yu | 2002-04-16 |
| 6365523 | Integrated high density plasma chemical vapor deposition (HDP-CVD) method and chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layers | Syun-Ming Jang, Ying-Ho Chen | 2002-04-02 |