Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429119 | Dual damascene process to reduce etch barrier thickness | Li-Chih Chao, Chia-Shiung Tsai, Ming-Huei Lui, Chao-Cheng Chen | 2002-08-06 |
| 6399483 | Method for improving faceting effect in dual damascene process | Ming-Huei Lui, Hun-Jan Tao, Chia-Shiung Tsai | 2002-06-04 |
| 6383943 | Process for improving copper fill integrity | Chao-Cheng Chen, Jyu-Horng Shieh, Chia-Shiung Tsai, Bor-Shyang Lin | 2002-05-07 |