Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444517 | High Q inductor with Cu damascene via/trench etching simultaneous module | Heng-Ming Hsu, Shyh-Chyi Wong, Chaochieh Tsai, Ssu-Pin Ma, Liang-Kun Huang | 2002-09-03 |
| 6440863 | Plasma etch method for forming patterned oxygen containing plasma etchable layer | Chia-Shiun Tsai, Hun-Jan Tao | 2002-08-27 |
| 6429119 | Dual damascene process to reduce etch barrier thickness | Li-Chih Chao, Chia-Shiung Tsai, Ming-Huei Lui, Jen-Cheng Liu | 2002-08-06 |
| 6383943 | Process for improving copper fill integrity | Jen-Cheng Liu, Jyu-Horng Shieh, Chia-Shiung Tsai, Bor-Shyang Lin | 2002-05-07 |