BL

Bor-Shyang Lin

TSMC: 1 patents #199 of 614Top 35%
Overall (2002): #248,593 of 266,432Top 95%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6383943 Process for improving copper fill integrity Chao-Cheng Chen, Jen-Cheng Liu, Jyu-Horng Shieh, Chia-Shiung Tsai 2002-05-07