Issued Patents 2002
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500753 | Method to reduce the damages of copper lines | Syun-Ming Jang, Ying-Ho Chen, Jih-Churng Twu | 2002-12-31 |
| 6501186 | Bond pad having variable density via support and method for fabrication | Tsu Shih | 2002-12-31 |
| 6500770 | Method for forming a multi-layer protective coating over porous low-k material | Yu-Huei Cheng | 2002-12-31 |
| 6500749 | Method to improve copper via electromigration (EM) resistance | Chung-Shi Liu, Shau-Lin Shue | 2002-12-31 |
| 6492269 | Methods for edge alignment mark protection during damascene electrochemical plating of copper | Chung-Shi Liu, Shau-Lin Shue, Ching-Hua Hsieh | 2002-12-10 |
| 6465323 | Method for forming semiconductor integrated circuit microelectronic fabrication having multiple gate dielectric layers with multiple thicknesses | Mo Yu, Shih-Chang Chen | 2002-10-15 |
| 6458689 | Use of PE-SiON or PE-Oxide for contact or via photo and for defect reduction with oxide and w chemical-mechanical polish | Syun-Ming Jang, Tsu Shih, Anthony Yen, Jih-Chuyng Twu | 2002-10-01 |
| 6444371 | Prevention of die loss to chemical mechanical polishing | Syun-Ming Jang, Jui-Yu Chang, Chung-Long Chang, Tsu Shih, Jeng-Horng Chen | 2002-09-03 |
| 6436771 | Method of forming a semiconductor device with multiple thickness gate dielectric layers | Syun-Ming Jang, Mong-Song Liang | 2002-08-20 |
| 6423625 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chung-Shi Liu, Jane-Bai Lai | 2002-07-23 |
| 6424021 | Passivation method for copper process | Chung-Shi Liu | 2002-07-23 |
| 6413863 | Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process | Chung-Shi Liu, Shau-Lin Shue | 2002-07-02 |
| 6403432 | Hardmask for a salicide gate process with trench isolation | Syun-Ming Jang | 2002-06-11 |
| 6403465 | Method to improve copper barrier properties | Chung-Shi Liu | 2002-06-11 |
| 6399487 | Method of reducing phase transition temperature by using silicon-germanium alloys | Jane-Bai Lai, Lih-Juan Chen, Chung-Shi Liu | 2002-06-04 |
| 6395642 | Method to improve copper process integration | Chung-Shi Liu | 2002-05-28 |
| 6383935 | Method of reducing dishing and erosion using a sacrificial layer | Cheng-Chung Lin, Tsu Shih, Weng Chang | 2002-05-07 |
| 6372409 | Bonds pads equipped with heat dissipating rings and method for forming | — | 2002-04-16 |
| 6372664 | Crack resistant multi-layer dielectric layer and method for formation thereof | Syun-Ming Jang, Chu-Yun Fu | 2002-04-16 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Chung-Shi Liu, Shau-Lin Shue, Shih-Chi Lin, Ming-Jer Lee, Ying-Lang Wang +1 more | 2002-04-16 |
| 6372632 | Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer | Weng Chang, Jih-Chung Twu, Tsu Shih | 2002-04-16 |
| 6362085 | Method for reducing gate oxide effective thickness and leakage current | Mo Yu, Syun-Ming Jang | 2002-03-26 |
| 6361704 | Self stop aluminum pad for copper process | Tsu Shih | 2002-03-26 |
| 6353260 | Effective diffusion barrier | Chung-Shi Liu, Shau-Lin Shue | 2002-03-05 |
| 6350688 | Via RC improvement for copper damascene and beyond technology | Chung-Shi Liu, Shau-Lin Shue | 2002-02-26 |