Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6423625 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Chung-Shi Liu | 2002-07-23 |
| 6399487 | Method of reducing phase transition temperature by using silicon-germanium alloys | Lih-Juan Chen, Chung-Shi Liu, Chen-Hua Yu | 2002-06-04 |