Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500749 | Method to improve copper via electromigration (EM) resistance | Shau-Lin Shue, Chen-Hua Yu | 2002-12-31 |
| 6492269 | Methods for edge alignment mark protection during damascene electrochemical plating of copper | Shau-Lin Shue, Chen-Hua Yu, Ching-Hua Hsieh | 2002-12-10 |
| 6468873 | MIM formation method on CU damscene | Shau-Lin Shue | 2002-10-22 |
| 6424021 | Passivation method for copper process | Chen-Hua Yu | 2002-07-23 |
| 6423625 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Jane-Bai Lai | 2002-07-23 |
| 6413863 | Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process | Shau-Lin Shue, Chen-Hua Yu | 2002-07-02 |
| 6403465 | Method to improve copper barrier properties | Chen-Hua Yu | 2002-06-11 |
| 6399487 | Method of reducing phase transition temperature by using silicon-germanium alloys | Jane-Bai Lai, Lih-Juan Chen, Chen-Hua Yu | 2002-06-04 |
| 6395642 | Method to improve copper process integration | Chen-Hua Yu | 2002-05-28 |
| 6387800 | Method of forming barrier and seed layers for electrochemical deposition of copper | Shau-Lin Shue | 2002-05-14 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Shau-Lin Shue, Chen-Hua Yu, Shih-Chi Lin, Ming-Jer Lee, Ying-Lang Wang +1 more | 2002-04-16 |
| 6353260 | Effective diffusion barrier | Shau-Lin Shue, Chen-Hua Yu | 2002-03-05 |
| 6350688 | Via RC improvement for copper damascene and beyond technology | Shau-Lin Shue, Chen-Hua Yu | 2002-02-26 |