Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500753 | Method to reduce the damages of copper lines | Syun-Ming Jang, Ying-Ho Chen, Chen-Hua Yu | 2002-12-31 |
| 6500274 | Apparatus and method for wet cleaning wafers without ammonia vapor damage | Ming-Dar Guo, Chia-Chun Cheng | 2002-12-31 |
| 6429118 | Elimination of electrochemical deposition copper line damage for damascene processing | Ying-Ho Chen, Syun-Ming Jang, Tsu Shih | 2002-08-06 |
| 6425191 | Apparatus and method for reducing solvent residue in a solvent-type dryer for semiconductor wafers | Rong-Hui Kao, Ming-Dar Guo, Tsung-Chieh Tsai, Chia-Chun Cheng | 2002-07-30 |
| 6417106 | Underlayer liner for copper damascene in low k dielectric | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2002-07-09 |
| 6405452 | Method and apparatus for drying wafers after wet bench | Ming-Dar Guo, Yu-Chien Hsiao, Chia-Chun Cheng | 2002-06-18 |
| 6391780 | Method to prevent copper CMP dishing | Tsu Shih, Ying-Ho Chen | 2002-05-21 |
| 6380056 | Lightly nitridation surface for preparing thin-gate oxides | Shau-Lin Shue | 2002-04-30 |
| 6376377 | Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity | Weng Chang, Ying-Ho Chen, Syun-Ming Jang | 2002-04-23 |
| 6358119 | Way to remove CU line damage after CU CMP | Tsu Shih, Ying-Ho Chen, Syun-Ming Jang | 2002-03-19 |