Issued Patents 2002
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501186 | Bond pad having variable density via support and method for fabrication | Chen-Hua Yu | 2002-12-31 |
| 6495452 | Method to reduce capacitance for copper interconnect structures | — | 2002-12-17 |
| 6465897 | Method for photo alignment after CMP planarization | Jui-Yu Chang | 2002-10-15 |
| 6458689 | Use of PE-SiON or PE-Oxide for contact or via photo and for defect reduction with oxide and w chemical-mechanical polish | Chen-Hua Yu, Syun-Ming Jang, Anthony Yen, Jih-Chuyng Twu | 2002-10-01 |
| 6443810 | Polishing platen equipped with guard ring for chemical mechanical polishing | — | 2002-09-03 |
| 6444371 | Prevention of die loss to chemical mechanical polishing | Syun-Ming Jang, Jui-Yu Chang, Chen-Hua Yu, Chung-Long Chang, Jeng-Horng Chen | 2002-09-03 |
| 6429118 | Elimination of electrochemical deposition copper line damage for damascene processing | Ying-Ho Chen, Syun-Ming Jang, Jih-Churng Twu | 2002-08-06 |
| 6417106 | Underlayer liner for copper damascene in low k dielectric | Jih-Churng Twu, Ying-Ho Chen, Syun-Ming Jang | 2002-07-09 |
| 6409587 | Dual-hardness polishing pad for linear polisher and method for fabrication | Syun-Ming Jang, Ying-Ho Chen, Wen-Chih Chiou | 2002-06-25 |
| 6398627 | Slurry dispenser having multiple adjustable nozzles | Wen-Chih Chiou, Ying-Ho Chen, Syun-Ming Jang | 2002-06-04 |
| 6391780 | Method to prevent copper CMP dishing | Ying-Ho Chen, Jih-Churng Twu | 2002-05-21 |
| 6383935 | Method of reducing dishing and erosion using a sacrificial layer | Cheng-Chung Lin, Chen-Hua Yu, Weng Chang | 2002-05-07 |
| 6383930 | Method to eliminate copper CMP residue of an alignment mark for damascene processes | Ying-Ho Chen, Wen-Chih Chiou, Syun-Ming Jang | 2002-05-07 |
| 6372632 | Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer | Chen-Hua Yu, Weng Chang, Jih-Chung Twu | 2002-04-16 |
| 6361704 | Self stop aluminum pad for copper process | Chen-Hua Yu | 2002-03-26 |
| 6358119 | Way to remove CU line damage after CU CMP | Jih-Churng Twu, Ying-Ho Chen, Syun-Ming Jang | 2002-03-19 |
| 6350680 | Pad alignment for AlCu pad for copper process | Hung-Chang Hsieh, Chen-Cheng Kuo | 2002-02-26 |