Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472312 | Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation | Tien-I Bao, Syun-Ming Jang | 2002-10-29 |
| 6403464 | Method to reduce the moisture content in an organic low dielectric constant material | — | 2002-06-11 |
| 6383935 | Method of reducing dishing and erosion using a sacrificial layer | Cheng-Chung Lin, Chen-Hua Yu, Tsu Shih | 2002-05-07 |
| 6376377 | Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity | Ying-Ho Chen, Jih-Churng Twu, Syun-Ming Jang | 2002-04-23 |
| 6372632 | Method to eliminate dishing of copper interconnects by the use of a sacrificial oxide layer | Chen-Hua Yu, Jih-Chung Twu, Tsu Shih | 2002-04-16 |
| 6350694 | Reducing CMP scratch, dishing and erosion by post CMP etch back method for low-k materials | Tien-I Bao, Syun-Ming Jang | 2002-02-26 |
| 6346476 | Method for enhancing line-to-line capacitance uniformity of plasma enhanced chemical vapor deposited (PECVD) inter-metal dielectric (IMD) layers | Syun-Ming Jang | 2002-02-12 |