Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472312 | Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation | Syun-Ming Jang, Weng Chang | 2002-10-29 |
| 6455417 | Method for forming damascene structure employing bi-layer carbon doped silicon nitride/carbon doped silicon oxide etch stop layer | Syun-Ming Jang | 2002-09-24 |
| 6424038 | Low dielectric constant microelectronic conductor structure with enhanced adhesion and attenuated electrical leakage | Syun-Ming Jang | 2002-07-23 |
| 6407013 | Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive properties | Lain-Jong Li, Cheng-Chung Lin, Syun-Ming Jang | 2002-06-18 |
| 6358841 | Method of copper CMP on low dielectric constant HSQ material | Syun-Ming Jang | 2002-03-19 |
| 6350694 | Reducing CMP scratch, dishing and erosion by post CMP etch back method for low-k materials | Weng Chang, Syun-Ming Jang | 2002-02-26 |