Issued Patents 2002
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342448 | Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process | Jing-Cheng Lin, Shau-Lin Shue | 2002-01-29 |
| 6339029 | Method to form copper interconnects | Mong-Song Liang | 2002-01-15 |