Issued Patents All Time
Showing 26–50 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11797732 | Automated analog and mixed-signal circuit design and validation | Ashish Khandelwal, Nikhil Gupta, Timothy W. Fischer | 2023-10-24 |
| 11791296 | Dielectric and metallic nanowire bond layers | Scott R. Summerfelt, Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2023-10-17 |
| 11791248 | Coated semiconductor devices | — | 2023-10-17 |
| 11784103 | Covers for semiconductor package components | Leslie Edward Stark | 2023-10-10 |
| 11756914 | Microelectronic device with pillars having flared ends | — | 2023-09-12 |
| 11749616 | Industrial chip scale package for microelectronic device | — | 2023-09-05 |
| 11748533 | Programmatic circuit partitioning and topology identification | Ashish Khandelwal, Nikhil Gupta, Timothy W. Fischer | 2023-09-05 |
| 11727175 | Automated analog and mixed-signal circuit design and validation | Timothy W. Fischer, Ashish Khandelwal, Nikhil Gupta | 2023-08-15 |
| 11728242 | Semiconductor die orifices containing metallic nanowires | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2023-08-15 |
| 11714011 | Nanomaterials for attaching mechanical force sensors | Ralf Jakobskrueger Muenster, Benjamin Stassen Cook | 2023-08-01 |
| 11705414 | Structure and method for semiconductor packaging | — | 2023-07-18 |
| 11694947 | Multi-pitch leads | Nazila Dadvand | 2023-07-04 |
| 11682609 | Three-dimensional functional integration | — | 2023-06-20 |
| 11676951 | Package for power semiconductor devices | Steven R. Tom, Paul Brohlin | 2023-06-13 |
| 11676884 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Benjamin Michael Sutton, Subhashish Mukherjee | 2023-06-13 |
| 11658083 | Film covers for sensor packages | Leslie Edward Stark, Steven Kummerl, Wai Lee | 2023-05-23 |
| 11640968 | Inductor on microelectronic die | — | 2023-05-02 |
| 11636242 | Process aware compact representation of integrated circuits | Ashish Khandelwal, Nikhil Gupta, Timothy W. Fischer | 2023-04-25 |
| 11631632 | Three dimensional package for semiconductor devices and external components | Christopher Daniel Manack | 2023-04-18 |
| 11573324 | Lidar imaging receiver | — | 2023-02-07 |
| 11552006 | Coated semiconductor devices | — | 2023-01-10 |
| 11476175 | Sensor package cavities with polymer films | Leslie Edward Stark | 2022-10-18 |
| 11444048 | Shaped interconnect bumps in semiconductor devices | — | 2022-09-13 |
| 11430722 | Integration of a passive component in a cavity of an integrated circuit package | Jeffrey Anthony Morroni, Rajeev Joshi, Sujan Kundapur Manohar, Yogesh Kumar Ramadass, Anindya Poddar | 2022-08-30 |
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Siva Prakash Gurrum, Christopher Daniel Manack | 2022-07-12 |