Issued Patents All Time
Showing 51–75 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335570 | Multirow gull-wing package for microelectronic devices | — | 2022-05-17 |
| 11282770 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Nazila Dadvand | 2022-03-22 |
| 11282807 | Nanowires plated on nanoparticles | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2022-03-22 |
| 11264336 | Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices | — | 2022-03-01 |
| 11239195 | Nanowire interfaces | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2022-02-01 |
| 11201096 | Packaged device with die wrapped by a substrate | — | 2021-12-14 |
| 11195811 | Dielectric and metallic nanowire bond layers | Scott R. Summerfelt, Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2021-12-07 |
| 11177195 | Multi-lead adapter | Abram Castro | 2021-11-16 |
| 11152322 | Leadframes in semiconductor devices | — | 2021-10-19 |
| 11094659 | Microelectronic device with pillars having flared ends | — | 2021-08-17 |
| 11094616 | Multi-pitch leads | Nazila Dadvand | 2021-08-17 |
| 11094620 | Integrated capacitor with extended head bump bond pillar | — | 2021-08-17 |
| 11064615 | Wafer level bump stack for chip scale package | — | 2021-07-13 |
| 10991641 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Benjamin Michael Sutton, Subhashish Mukherjee | 2021-04-27 |
| 10985096 | Electrical device terminal finishing | — | 2021-04-20 |
| 10957635 | Multi-chip package with high thermal conductivity die attach | Nazila Dadvand, Benjamin Stassen Cook | 2021-03-23 |
| 10957666 | Pre-molded leadframes in semiconductor devices | — | 2021-03-23 |
| 10892209 | Semiconductor device with metal die attach to substrate with multi-size cavity | Benjamin Stassen Cook, Nazila Dadvand | 2021-01-12 |
| 10840171 | Integrated circuit package including inward bent leads | Michael L. Meyers, Scott F. Eisenhart, Richard J. Saye | 2020-11-17 |
| 10832993 | Packaged multichip device with stacked die having a metal die attach | Nazila Dadvand, Benjamin Stassen Cook | 2020-11-10 |
| 10832991 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Nazila Dadvand | 2020-11-10 |
| 10734313 | Integration of a passive component in an integrated circuit package | Jeffrey Anthony Morroni, Rajeev Joshi, Sujan Kundapur Manohar, Yogesh Kumar Ramadass, Anindya Poddar | 2020-08-04 |
| 10658278 | Electrical device terminal finishing | — | 2020-05-19 |
| 10643929 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Benjamin Michael Sutton, Subhashish Mukherjee | 2020-05-05 |
| 10636758 | Expanded head pillar for bump bonds | — | 2020-04-28 |