Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10330537 | Thermometer device and method of making | — | 2019-06-25 |
| 9899339 | Discrete device mounted on substrate | Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak | 2018-02-20 |
| 9664574 | Thermometer device and method of making | — | 2017-05-30 |
| 9354186 | X-ray sensor and signal processing assembly for an X-ray computed tomography machine | Eduardo Bartolome | 2016-05-31 |
| 9321631 | Method for embedding controlled-cavity MEMS package in integration board | Christopher Daniel Manack, Frank Stepniak | 2016-04-26 |
| 9305871 | High pin count, small packages having heat-dissipating pad | — | 2016-04-05 |
| 9111845 | Integrated circuit package with printed circuit layer | Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak | 2015-08-18 |
| 9013032 | High pin count, small SON/QFN packages | — | 2015-04-21 |
| 8945986 | Electronic assembly with three dimensional inkjet printed traces | Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak | 2015-02-03 |
| 8866237 | Methods for embedding controlled-cavity MEMS package in integration board | Christopher Daniel Manack, Frank Stepniak | 2014-10-21 |
| 8836107 | High pin count, small SON/QFN packages having heat-dissipating pad | — | 2014-09-16 |
| 8816513 | Electronic assembly with three dimensional inkjet printed traces | Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak | 2014-08-26 |
| 8810023 | Cantilever packages for sensor MEMS (micro-electro-mechanical system) | — | 2014-08-19 |
| 8669647 | Method for semiconductor leadframes in low volume and rapid turnaround | — | 2014-03-11 |
| 8624363 | Method for semiconductor leadframes in low volume and rapid turnaround | — | 2014-01-07 |
| 8569082 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Steven Kummerl | 2013-10-29 |
| 8476760 | Electroplated posts with reduced topography and stress | Manoj Kumar Jain | 2013-07-02 |
| 8361839 | Structure and method for power field effect transistor | — | 2013-01-29 |
| 8358014 | Structure and method for power field effect transistor | — | 2013-01-22 |
| 8304868 | Multi-component electronic system having leadframe with support-free with cantilever leads | Michael G. Amaro, Steven Kummerl, Taylor R. Efland | 2012-11-06 |
| 8133763 | Method for semiconductor leadframes in low volume and rapid turnaround | — | 2012-03-13 |
| 8129228 | Manufacturing method for integrating a shunt resistor into a semiconductor package | Ubol Udompanyavit, Gerald W. Steele, Jason Marc Cole, Steven Kummerl | 2012-03-06 |
| 8072770 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Steven Kummerl | 2011-12-06 |
| 8017410 | Power semiconductor devices having integrated inductor | — | 2011-09-13 |
| 7910471 | Bumpless wafer scale device and board assembly | Edgar Zuniga-Ortiz | 2011-03-22 |