Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9777011 | Process for preparing oxycodone compositions | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2017-10-03 |
| 9589093 | Multilevel via placement with improved yield in dual damascene interconnection | — | 2017-03-07 |
| 9522919 | Oxycodone compositions | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2016-12-20 |
| 9073933 | Oxycodone hydrochloride having less than 25 PPM 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2015-07-07 |
| 9023327 | DICKKOPF-1 expression modulating compositions and uses thereof | Uma Santhanam, Sunghan Yim | 2015-05-05 |
| 8822687 | 8a,14-dihydroxy-7,8-dihydrocodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2014-09-02 |
| 8613911 | Compositions having a plurality of discrete emulsions | Faith A. Corbo, Anthony D. Gonzalez | 2013-12-24 |
| 8575106 | Cosmetic uses of modified stressed yeast extracts and related compositions | Uma Santhanam, Christos D. Kyrou, Desiree Mazich, Hussam Hisham Shaheen | 2013-11-05 |
| 7683072 | Oxycodone hydrochloride having less than 25 ppm 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2010-03-23 |
| 7674800 | Oxycodone hydrochloride having less than 25 PPM 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2010-03-09 |
| 7674799 | Oxycodone hydrochloride having less than 25 ppm 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2010-03-09 |
| 7674798 | Oxycodone hydrochloride having less than 25 ppm 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2010-03-09 |
| 7192863 | Method of eliminating etch ridges in a dual damascene process | Lu Zhijian | 2007-03-20 |
| 7129248 | Process for preparing oxycodone hydrochloride having less than 25 ppm 14-hydroxycodeinone | Robert Chapman, Lonn S. Rider, Donald J. Kyle, Robert Kupper | 2006-10-31 |
| 6903000 | System for improving thermal stability of copper damascene structure | Jiong-Ping Lu, Tz-Cheng Chiu, Changming Jin, David Permana, Ting Tsui | 2005-06-07 |
| 6835648 | Semiconductor PMD layer dielectric | Peter Yu Fei Huang | 2004-12-28 |
| 6777300 | Method to improve silicide formation on polysilicon | Jorge A. Kittl | 2004-08-17 |
| 6680249 | Si-rich surface layer capped diffusion barriers | Jiong-Ping Lu, Wei-Yung Hsu, Richard Allen Faust | 2004-01-20 |
| 6677232 | Method for fabricating metal conductors and multi-level interconnects in a semiconductor device | Wei-Yung Hsu, Vincent T. Cordasco | 2004-01-13 |
| 6660650 | Selective aluminum plug formation and etchback process | Anthony Konecni, Wei-Yung Hsu | 2003-12-09 |
| 6544886 | Process for isolating an exposed conducting surface | Jiong-Ping Lu, Duane E. Carter, Yung Liu | 2003-04-08 |
| 6461955 | Yield improvement of dual damascene fabrication through oxide filling | Robert Tsu, William R. McKee | 2002-10-08 |
| 6372566 | Method of forming a silicide layer using metallic impurities and pre-amorphization | Jorge A. Kittl | 2002-04-16 |
| 6358849 | Integrated circuit interconnect and method | Robert H. Havemann, Girish Dixit, Manoj Kumar Jain, Eden Zielinski, Jeffrey Alan West | 2002-03-19 |
| 6355559 | Passivation of inlaid metallization | Robert H. Havemann, Girish Dixit | 2002-03-12 |