Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777534 | Three-dimensional stacking structure | Chaochieh Tsai | 2020-09-15 |
| 10157885 | Package structure having magnetic bonding between substrates | Richard Burton Cassidy, II, Chaochieh Tsai | 2018-12-18 |
| 9748206 | Three-dimensional stacking structure and manufacturing method thereof | Chaochieh Tsai | 2017-08-29 |
| 6835648 | Semiconductor PMD layer dielectric | Qi-Zhong Hong | 2004-12-28 |
| 6251568 | Methods and apparatus for stripping photoresist and polymer layers from a semiconductor stack in a non-corrosive environment | Shao-Wen Hsia | 2001-06-26 |