Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6329282 | Method of improving the texture of aluminum metallization for tungsten etch back processing | Wei-Yung Hsu | 2001-12-11 |
| 6323553 | Reduced temperature contact/via filling | Wei-Yung Hsu | 2001-11-27 |
| 6245672 | Method of forming diffusion barriers for copper metallization in integrated cirucits | Wei-Yung Hsu, Jiong-Ping Lu, Robert H. Havemann | 2001-06-12 |
| 6150252 | Multi-stage semiconductor cavity filling process | Wei-Yung Hsu | 2000-11-21 |
| 6143645 | Reduced temperature contact/via filling | Wei-Yung Hsu | 2000-11-07 |
| 6120842 | TiN+Al films and processes | Jiong-Ping Lu, Wei-Yung Hsu | 2000-09-19 |
| 6114733 | Surface protective layer for improved silicide formation | — | 2000-09-05 |
| 6077774 | Method of forming ultra-thin and conformal diffusion barriers encapsulating copper | Wei-Yung Hsu | 2000-06-20 |
| 6077782 | Method to improve the texture of aluminum metallization | Wei-Yung Hsu, Robert H. Havemann | 2000-06-20 |
| 6054382 | Method of improving texture of metal films in semiconductor integrated circuits | Wei-Yung Hsu | 2000-04-25 |
| 6048784 | Transistor having an improved salicided gate and method of construction | Jorge A. Kittl | 2000-04-11 |
| 6046113 | Combined dry and wet etch for improved silicide formation | Shouli Steve Hsia | 2000-04-04 |
| 6046105 | Preferential lateral silicidation of gate with low source and drain silicon consumption | Jorge A. Kittl | 2000-04-04 |
| 6037013 | Barrier/liner with a SiNx-enriched surface layer on MOCVD prepared films | Wei-Yung Hsu, Jiong-Ping Lu | 2000-03-14 |
| 6037254 | Method of making a surface protective layer for improved silicide formation | — | 2000-03-14 |
| 6008117 | Method of forming diffusion barriers encapsulating copper | Shin-Puu Jeng, Wei-Yung Hsu | 1999-12-28 |
| 5985763 | Method for producing barrier-less plug structures | Wei-Yung Hsu, Shin-Puu Jeng | 1999-11-16 |
| 5945737 | Thin film or solder ball including a metal and an oxide, nitride, or carbide precipitate of an expandable or contractible element | Cyril Cabral, Jr., Lawrence A. Clevenger, Francois M. d'Heurle | 1999-08-31 |
| 5892282 | Barrier-less plug structure | Wei-Yung Hsu, Shin-Puu Jeng | 1999-04-06 |
| 5834374 | Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates | Cyril Cabral, Jr., Lawrence A. Clevenger, Francois M. d'Heurle | 1998-11-10 |
| 5668411 | Diffusion barrier trilayer for minimizing reaction between metallization layers of integrated circuits | Shin-Puu Jeng, Robert H. Havemann | 1997-09-16 |
| 5624869 | Method of forming a film for a multilayer Semiconductor device for improving thermal stability of cobalt silicide using platinum or nitrogen | Paul D. Agnello, Cyril Cabral, Jr., Lawrence A. Clevenger, Matthew W. Copel, Francois M. d'Heurle | 1997-04-29 |
| 5605724 | Method of forming a metal conductor and diffusion layer | Robert H. Havemann | 1997-02-25 |