Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815642 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Margaret Simmons-Matthews, Raymundo M. Camenforte | 2014-08-26 |
| 8723330 | Protective layer for protecting TSV tips during thermo-compressive bonding | — | 2014-05-13 |
| 8623763 | Protective layer for protecting TSV tips during thermo-compressive bonding | — | 2014-01-07 |
| 8575758 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Margaret Simmons-Matthews, Raymundo M. Camenforte | 2013-11-05 |
| 8378701 | Non-contact determination of joint integrity between a TSV die and a package substrate | — | 2013-02-19 |
| 8378495 | Integrated circuit (IC) having TSVS with dielectric crack suppression structures | — | 2013-02-19 |
| 8344493 | Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips | Jeffrey E. Brighton, Margaret Simmons-Matthews | 2013-01-01 |
| 8309957 | Replacement of scribeline padframe with saw-friendly design | Basab Chatterjee, Gregory B. Shinn | 2012-11-13 |
| 8304893 | Integrated circuits having TSVs including metal gettering dielectric liners | — | 2012-11-06 |
| 8298944 | Warpage control for die with protruding TSV tips during thermo-compressive bonding | — | 2012-10-30 |
| 8299612 | IC devices having TSVS including protruding tips having IMC blocking tip ends | Young-Joon Park | 2012-10-30 |
| 8294261 | Protruding TSV tips for enhanced heat dissipation for IC devices | Kazuaki MAWATARI, Kengo Aoya, Yoshikatsu Umeda | 2012-10-23 |
| 8227839 | Integrated circuit having TSVS including hillock suppression | — | 2012-07-24 |
| 8143704 | Electronic assemblies including mechanically secured protruding bonding conductor joints | — | 2012-03-27 |
| 8125053 | Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices | Patricia Diane Vincent, Robert A. Tuerck | 2012-02-28 |
| 8125054 | Semiconductor device having enhanced scribe and method for fabrication | Craig Beddingfield | 2012-02-28 |
| 8097964 | IC having TSV arrays with reduced TSV induced stress | Margaret Simmons-Matthews, Masazumi Amagai | 2012-01-17 |
| 8039385 | IC devices having TSVS including protruding tips having IMC blocking tip ends | Young-Joon Park | 2011-10-18 |
| 7943514 | Integrated circuits having TSVs including metal gettering dielectric liners | — | 2011-05-17 |
| 7708947 | Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions therefor | Praveen C. Ramamurthy | 2010-05-04 |
| 7309651 | Method for improving reliability of copper interconnects | Michael Barth, Steven P. Zuhoski | 2007-12-18 |
| 7265560 | Temperature compensated vapor sensor | Jared Starling | 2007-09-04 |
| 6841455 | Scribe street seals in semiconductor devices and method of fabrication | Paul Gillespie | 2005-01-11 |
| 6620343 | PTC conductive composition containing a low molecular weight polyethylene processing aid | Edward J. Blok | 2003-09-16 |
| 6584940 | Flue pipe control | Prasad S. Khadkikar, Richard L. Gerich, Christine M. Hudson, Derek Rose, Douglas J. Kempf +2 more | 2003-07-01 |