Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024576 | Semiconductor package with underfill between a sensor coil and a semiconductor die | Byron Lovell Williams, Thomas D. Bonifield | 2021-06-01 |
| 10998278 | Process and method for achieving high immunity to ultrafast high voltage transients across inorganic galvanic isolation barriers | Thomas D. Bonifield, Yoshihiro Takei, Mitsuhiro Sugimoto | 2021-05-04 |
| 10978548 | Integrated capacitor with sidewall having reduced roughness | Elizabeth Costner Stewart, Thomas D. Bonifield, Joseph A. Gallegos, Jay Sung Chun, Zhiyi Yu | 2021-04-13 |
| 10957655 | Integrated circuit with inductors having electrically split scribe seal | Sreeram Subramanyam Nasum, Kumar Anurag Shrivastava | 2021-03-23 |
| 10886120 | Hydrogen ventilation of CMOS wafers | Adrian Salinas, Elizabeth Costner Stewart, Dhanoop Varghese, Thomas D. Bonifield | 2021-01-05 |
| 10847605 | Methods and apparatus for high voltage integrated circuit capacitors | Thomas D. Bonifield, Byron Lovell Williams | 2020-11-24 |
| 10811492 | Method and device for patterning thick layers | Byron Lovell Williams, John B. Robbins | 2020-10-20 |
| 10707297 | High voltage galvanic isolation device | Thomas D. Bonifield, Byron Lovell Williams | 2020-07-07 |
| 10679935 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Byron Lovell Williams, David Leonard Larkin, Weidong Tian | 2020-06-09 |
| 10665543 | Oxidation resistant barrier metal process for semiconductor devices | Kezhakkedath R. Udayakumar, Eric H. Warninghoff, Alan G. Merriam, Rick A. Faust | 2020-05-26 |
| 10629562 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Anderson Li, Arvin Nono Verdeflor | 2020-04-21 |
| 10418320 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Byron Lovell Williams, David Leonard Larkin, Weidong Tian | 2019-09-17 |
| 10366958 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Byron Lovell Williams | 2019-07-30 |
| 10147784 | High voltage galvanic isolation device | Thomas D. Bonifield, Byron Lovell Williams | 2018-12-04 |
| 10109597 | Crack deflector structure for improving semiconductor device robustness against saw-induced damage | Thomas D. Bonifield, Basab Chatterjee | 2018-10-23 |
| 10109574 | Structure and method for improving high voltage breakdown reliability of a microelectronic device | Byron Lovell Williams, David Leonard Larkin, Weidong Tian | 2018-10-23 |
| 10008450 | Oxidation resistant barrier metal process for semiconductor devices | Kezhakkedath R. Udayakumar, Eric H. Warninghoff, Alan G. Merriam, Rick A. Faust | 2018-06-26 |
| 9768245 | High breakdown voltage microelectronic device isolation structure with improved reliability | Thomas D. Bonifield, Byron Lovell Williams | 2017-09-19 |
| 9741787 | Methods and apparatus for high voltage integrated circuit capacitors | Thomas D. Bonifield, Byron Lovell Williams | 2017-08-22 |
| 9704804 | Oxidation resistant barrier metal process for semiconductor devices | Kezhakkedath R. Udayakumar, Eric H. Warninghoff, Alan G. Merriam, Rick A. Faust | 2017-07-11 |
| 9583558 | High breakdown voltage microelectronic device isolation structure with improved reliability | Thomas D. Bonifield, Byron Lovell Williams | 2017-02-28 |
| 9525021 | Methods and apparatus for high voltage integrated circuit capacitors | Thomas D. Bonifield, Byron Lovell Williams | 2016-12-20 |
| 9299697 | High breakdown voltage microelectronic device isolation structure with improved reliability | Thomas D. Bonifield, Byron Lovell Williams | 2016-03-29 |
| 8912076 | Crack deflector structure for improving semiconductor device robustness against saw-induced damage | Thomas D. Bonifield, Basab Chatterjee | 2014-12-16 |
| 8859414 | Electronic assemblies including mechanically secured protruding bonding conductor joints | — | 2014-10-14 |