Issued Patents All Time
Showing 76–86 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557559 | Package structure | Tsung-Yen Lee, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-01-17 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng | 2022-12-20 |
| 11450622 | Semiconductor package | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11264300 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen | 2022-03-01 |
| 11011447 | Semiconductor package and method for forming the same | Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Kuang-Chun Lee, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |