Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252224 | Self-aligned insulated film for high-k metal gate device | Jin-Aun Ng, Maxi Chang, Jen-Sheng Yang, Ta-Wei Lin, Shih-Hao Lo +8 more | 2016-02-02 |
| 9177955 | Isolation region gap fill method | Tai-Chung Huang, Hao-Ming Lien, Tze-Liang Lee | 2015-11-03 |
| 9142402 | Uniform shallow trench isolation regions and the method of forming the same | Yu-Ling Liou, Pei-Ren Jeng, Hao-Ming Lien, Tze-Liang Lee | 2015-09-22 |
| 8895446 | Fin deformation modulation | Tai-Chun Huang, Hao-Ming Lien | 2014-11-25 |
| 8828841 | Semiconductor device and method of manufacture | Bing Chen, Tze-Liang Lee, Hao-Ming Lien | 2014-09-09 |
| 8822283 | Self-aligned insulated film for high-k metal gate device | Jin-Aun Ng, Maxi Chang, Jen-Sheng Yang, Ta-Wei Lin, Shih-Hao Lo +8 more | 2014-09-02 |
| 8748989 | Fin field effect transistors | Yu-Chao Lin, Shun-Hui Yang, Ryan Chia-Jen Chen, Chao-Cheng Chen | 2014-06-10 |
| 8735252 | Method of semiconductor integrated circuit fabrication | Weibo Yu, Ming-Hsi Yeh, Hao-Ming Lien, Chao-Cheng Chen, Syun-Ming Jang | 2014-05-27 |
| 8736016 | Strained isolation regions | Mong-Song Liang, Tze-Liang Lee, Kuo-Tai Huang, Chao-Cheng Chen, Hao-Ming Lien | 2014-05-27 |
| 8658539 | Fin profile structure and method of making same | Chia-Wei Chang, Chih-Fang Liu, Tai-Chun Huang, Ryan Chia-Jen Chen | 2014-02-25 |
| 8629508 | Semiconductor device and method of manufacture | Bing Chen, Tze-Liang Lee, Hao-Ming Lien | 2014-01-14 |
| 8580653 | Method for fabricating an isolation structure | Tze-Liang Lee, Pei-Ren Jeng, Chu-Yun Fu, Chyi Shyuan Chern, Jui-Hei Huang +1 more | 2013-11-12 |
| 8546891 | Fin profile structure and method of making same | Chia-Wei Chang, Chih-Fang Liu, Tai-Chun Huang, Ryan Chia-Jen Chen | 2013-10-01 |
| 8461654 | Spacer shape engineering for void-free gap-filling process | Ming-Yuan Wu, Yi-Shien Mor, Chiung-Han Yeh, Kong-Beng Thei, Harry-Hak-Lay Chuang +1 more | 2013-06-11 |
| 8404561 | Method for fabricating an isolation structure | Tze-Liang Lee, Pei-Ren Jeng, Chu-Yun Fu, Chyi Shyuan Chern, Jui-Hei Huang +1 more | 2013-03-26 |
| 8329552 | Semiconductor device and method of manufacture | Bing Chen, Tze-Liang Lee, Hao-Ming Lien | 2012-12-11 |
| 8048752 | Spacer shape engineering for void-free gap-filling process | Ming-Yuan Wu, Yi-Shien Mor, Chiung-Han Yeh, Kong-Beng Thei, Harry-Hak-Lay Chuang +1 more | 2011-11-01 |
| 7592710 | Bond pad structure for wire bonding | Chin-Chiu Hsia, Chih-Hsiang Yao, Tai-Chun Huang | 2009-09-22 |
| 6541834 | Silicon pressure micro-sensing device and the fabrication process | Jin-Shown Shie, Ji-Cheng Lin, Chun-Te Lin, Shih-han Yu, Kuo-Ning Chiang | 2003-04-01 |