Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2021-04-13 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-05-19 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2020-02-18 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2020-01-14 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2019-04-30 |
| 9978716 | Package structure and method for manufacturing the same | Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Hsuan-Ting Kuo, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2017-01-03 |