Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985061 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai | 2021-04-20 |
| 10923573 | Forming metal contacts on metal gates | Chao-Hsun Wang, Yu-Feng Yin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang | 2021-02-16 |
| 10909291 | Circuit correction system and method for increasing coverage of scan test | Tse-Wei Wu, Yu Su, Min-Hsiu Tsai | 2021-02-02 |
| 10840134 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Kai-Shiang Kuo +3 more | 2020-11-17 |
| 10755945 | Metal contacts on metal gates and methods thereof | Pang-Sheng Chang, Yu-Feng Yin, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang +9 more | 2020-08-25 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2020-07-28 |
| 10714329 | Pre-clean for contacts | Yu-Ting Lin, Rueijer Lin, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu | 2020-07-14 |
| 10692814 | Chemical direct pattern plating method | Wen-Jiun Liu, Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang | 2020-06-23 |
| 10508356 | Electro-plating and apparatus for performing the same | Hung-Wen Su, Minghsing Tsai | 2019-12-17 |
| 10505045 | Fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact | Chao-Hsun Wang, Kuo-Yi Chao, Rueijer Lin, Mei-Yun Wang | 2019-12-10 |
| 10483165 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai | 2019-11-19 |
| 10418453 | Forming metal contacts on metal gates | Chao-Hsun Wang, Yu-Feng Yin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang | 2019-09-17 |
| 10269627 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Kai-Shiang Kuo +3 more | 2019-04-23 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2019-02-05 |
| 10186456 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chi-Cheng Hung, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai | 2019-01-22 |
| 9991125 | Method for forming semiconductor device structure | Rueijer Lin, Chun-Chieh Lin, Huang-Yi Huang | 2018-06-05 |
| 9786604 | Metal cap apparatus and method | Hung-Wen Su, Chih-Yi Chang, Liang-Yueh Ou Yang | 2017-10-10 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Kai-Shiang Kuo +3 more | 2017-09-05 |
| 9632498 | Systems and methods of compensating for filling material losses in electroplating processes | Chih-Yi Chang, Liang-Yueh Ou Yang, Hung-Wen Su | 2017-04-25 |
| 9601430 | Semiconductor device structure and method for forming the same | Rueijer Lin, Chun-Chieh Lin, Huang-Yi Huang | 2017-03-21 |
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Hung-Wen Su, Mingh-Hsing Tsai, Syun-Ming Jang | 2017-02-07 |
| 9518334 | Electro-plating and apparatus for performing the same | Hung-Wen Su, Minghsing Tsai | 2016-12-13 |
| 9476135 | Electro chemical plating process | Chih-Yi Chang, Liang-Yueh Ou Yang, Hung-Wen Su | 2016-10-25 |
| 9209073 | Metal cap apparatus and method | Liang-Yueh Ou Yang, Chih-Yi Chang, Hung-Wen Su | 2015-12-08 |