Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592311 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2013-11-26 |
| 8575018 | Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area | Yaojian Lin, Kang Chen, Pandi C. Marimuthu, Rajendra D. Pendse | 2013-11-05 |
| 8501618 | Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis | Yaojian Lin, Xia Feng, Kang Chen | 2013-08-06 |
| 8504011 | Method and system for mobility parameter negotiation between base stations | Yin Gao | 2013-08-06 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2013-06-04 |
| 8445323 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Kang Chen, Haijing Cao | 2013-05-21 |
| 8445990 | Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die | Yaojian Lin, Kang Chen | 2013-05-21 |
| 8409970 | Semiconductor device and method of making integrated passive devices | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2013-04-02 |
| 8409926 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Xia Feng, Xusheng Bao | 2013-04-02 |
| 8343809 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Xia Feng | 2013-01-01 |
| 8310058 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2012-11-13 |
| 8283250 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2012-10-09 |
| 8263437 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Kang Chen, Haijing Cao | 2012-09-11 |
| 8193604 | Semiconductor package with semiconductor core structure and method of forming the same | Yaojian Lin, Kang Chen, Haijing Cao | 2012-06-05 |
| 8193316 | TACI-Fc fusion proteins, methods of making and uses thereof | Zheng Liu | 2012-06-05 |
| 8183087 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Kang Chen, Haijing Cao | 2012-05-22 |
| 8183095 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Xia Feng | 2012-05-22 |
| 8168470 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Kang Chen, Haijing Cao | 2012-05-01 |
| 8110477 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Kang Chen, Haijing Cao | 2012-02-07 |
| 7935570 | Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars | Yaojian Lin, Kang Chen, Haijing Cao | 2011-05-03 |
| 7858441 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Kang Chen, Haijing Cao | 2010-12-28 |
| 7790503 | Semiconductor device and method of forming integrated passive device module | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2010-09-07 |
| 7772081 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Kang Chen, Haijing Cao | 2010-08-10 |
| 7749814 | Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate | Yaojian Lin, Haijing Cao, Kang Chen, Qing Zhang | 2010-07-06 |
| 7750138 | Angiogenesis-inhibiting chimeric protein and the use | Zheng Liu, DeChao Yu | 2010-07-06 |